With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price / performance ratio for their water cooling system, for example.
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Suitable for overclocking
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Excellent thermal conductivity
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No curing
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Silicone free
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Not electrically conductive
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Applicable to aluminum coolers
(warning label is exclusively for Conductonaut!)
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operation area
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Rating
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Thermal conductivity
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****
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Sub-zero overclocking
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****
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Overclocking
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*****
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Water cooling
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*****
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Air cooling
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*****
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Silicone sensitive applications
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*****
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The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling sector.
The Hydronaut thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the thermal paste can be applied very easily.
Hydronaut achieves optimal values for use on medium and large-area heat carriers. The product, manufactured according to the ROHS standard, is an easily applied heat transfer medium for demanding users.
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Thermal resistance
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0.0076 K / W
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Electrical conductivity *
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0 pS / m
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viscosity
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140-190 pas
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Spec. Weight
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2.6g / cm3
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temperature
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-200 ° C / +350 ° C
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content
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1g
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* according to DIN 51412-1
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Please verify the specifications at the time of purchase. No claim whatsoever would be accepted in case of specification error/mismatch, once the product is sold.
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